Capacitance
Technological Requirements
Flow：gluing evenly
Precision：Accurately AB glue ratio to avoid no curing ，slow curing or fast curing.
Stability：The glue couldn’t be blocked to make machine wear out frequently. Glue dispensing couldn’t effacted by climate .
Glue : Universal
Bubble: Glue potting keep product cooling , the glue must without bubble.
Speed: multi-head design can greatly improve production capacity .
Process Procedure
Basilemma ----- Steamed metallized layer-----slitting ----- winding----zinc spray ----- energize -----bonding lead ---- gluing ----close over ----test and packaging
Adhesive characteristics
Glue type:Epoxy
Feature :High additive and effected by climate .
Main ratio:5:1 .10:1 3:1
Curing condition:Glue dispensing evenly and accurate ratio
Gluing required: Accurately glue dispensing and no effcted by climate. Stable machine and genneral glue with good curing .
Successful Cases
Anhui Tongfeng electronic Co.ltd
Anhui Tongfeng electronic Co.ltd is a national key high-tech enterprise ,which be pointed by national torch plan as key and major enterprise in Tongling electronic material industrialization base . Tongfeng is the one of top hundred companies in electron component industry which is awarded national quality management advanced enterprise , national advanced enterprise of observing contracts and keeping promise . Tongfeng listed its shares on the Shanghai stock exchange who become the first listed enterprise in peer companies .
