SMD module
Technological Requirements
Thickness: Thickness evenly without any missing
Movement: Without any glue drop onto the lamp hat and lamp cup .
Speed: Muti-head greatly improve the production efficiency .
Flow ： Gluing evenly
Precision： Accurate ratio of AB glue without no curing , slow curing or fast curingThickness: Thickness evenly without any missing
Movement: Without any glue drop onto the lamp hat and lamp cup .
Speed: Muti-head greatly improve the production efficiency .
Process Procedure
SMD ---- reflow soldering ---- Electrical test---board split ----Online on the screw----whole series of electric testing module----glue pouring---- aging test----packing
Adhesive characteristics
Adhesive characteristics ：
Glue type： Epoxy
Feature： Mostly are transparent glue which effected by air temperature
Main ratio: 2:1 3:1
Curing condition : accurately ratio and stirring evenly
Gluing required : fast production capacity , good curing effect , accurate gluing quantity .
Glue type： Epoxy
Feature： Mostly are transparent glue which effected by air temperature
Main ratio: 2:1 3:1
Curing condition : accurately ratio and stirring evenly
Gluing required : fast production capacity , good curing effect , accurate gluing quantity .
Successful Cases
Suzhou posen photoelectric technology co., LTD
Posen Covers an area of 20000 square meters with advanced production equipment and high-quality management team . The company have employee more than 300 , including research and development staff and engineering technical persons nearly 30 ensure to provide personalized design and production to clients . They are provide comprehensive products including LED adverting module , indoor and outdoor module , led display, led controller and so on .
