PCB
Technological Requirements
Flow：gluing evenly
Precision：Accurately AB glue ratio avoid no curing ，slow curing or fast curing.
Thickness: Glue dispensing evenly .
Movement : The glue couldn’t drop onto the components and parts.
Speed: multi-head design can greatly improve production capacity .
Process Procedure
Adhesive characteristics
Glue type:Silicon ,PU
Feature:Vary kinds of glue required high precision .
Main ratio: 1:1 ----10:1
Curing condition:Glue dispensing evenly and accurate ratio
Gluing required: Glue pouring evenly to keep waterproof . High precision gluing with no drop Good curing effect .
Successful Cases
Shenzhen Topband Co., Ltd
Shenzhen Topband Co., Ltd. was registered in so called “China Silicon Valley” Shenzhen Hi-tech Industrial Park in 1996. After years of rapid development, Topband takes intellectual control as the core technology and becomes a leading supplier in intellectual control solutions, continuous expanding the applications. Our products cover household appliances intelligent control, HID, high-efficient lighting, motor, power, security, industrial automation and digital electronics, with the business of dozens of countries all over the world. In 2007, it was listed in Shenzhen Stock Exchange (the stock code as 002139). As a company with high sense of social responsibility, it is always a faithful companion of enterprises and consumers. At present, Topband has more than 3000 staffs, and covers an area of 50,000 square meters. Its total revenue is up to 1000,000,000 RMB in2012.
