Ballast
Technological Requirements
Flow: gluing evenly
Precision: Accurately AB glue ratio avoid no curing ，slow curing or fast curing.
Stability:The machine couldn’t be blocked or change pump or accessories frequently because of high additive .
Bubble: Glue potting keep product cooling , the glue must without bubble.
Speed: multi-head design can greatly improve production capacity .
Process Procedure
Adhesive characteristics
Adhesive characteristics :
Glue type : Silicon
Feature : High additive and sediment
Main ratio: 1:1 .
Curing condition : Glue dispensing evenly and accurate ratio
Gluing required : Accurately glue dispensing and good curing effect .
Successful Cases
Shenzhen Topband Co., Ltd
Shenzhen Topband Co., Ltd. was registered in so called “China Silicon Valley” Shenzhen Hi-tech Industrial Park in 1996. After years of rapid development, Topband takes intellectual control as the core technology and becomes a leading supplier in intellectual control solutions, continuous expanding the applications. Our products cover household appliances intelligent control, HID, high-efficient lighting, motor, power, security, industrial automation and digital electronics, with the business of dozens of countries all over the world. In 2007, it was listed in Shenzhen Stock Exchange (the stock code as 002139). As a company with high sense of social responsibility, it is always a faithful companion of enterprises and consumers. At present, Topband has more than 3000 staffs, and covers an area of 50,000 square meters. Its total revenue is up to 1000,000,000 RMB in2012.
